Plasma thin film deposition
We have three plasma deposition systems available for High Power Impulse Magnetron Sputtering (HiPIMS) and cathodic arc deposition. Capable of coating thin film of metal, metal oxide, metal nitride on various type of substrates.
Advanced magnetron sputtering
A universal research and development deposition system primarily for advanced magnetron sputtering including High Power Impulse Magnetron Sputtering (HiPIMS). This chamber is equipped with industry-standard mass flow controllers for multiple gas injection, residual gas analyzer (SRS) and Hiden EQP Mass and Energy Analyzer for Plasma Diagnostics. The chamber has a motorized substrate holder capable of rotating the substrate to various positions.
Cathodic arc deposition
A research and development chamber primarily used for cathodic arc deposition (both continuous and pulsed). It is also the system for depositing thin films of zinc oxide and related materials. Substrate treatment such as biasing and substrate heating up to 500°C are possible. This chamber has a residual gas analyzer (RGA by SRS) and a Raytek IR temperature sensor to monitor the substrate temperature. Industry-standard mass flow controllers are used. Typical base pressure is 2.0 x 10-6 Torr; the cryo-pump has a custom cool trap.
High Power Impulse Magnetron Sputtering (HiPIMS)
A research and development deposition system designed for advanced magnetron sputtering including High Power Impulse Magnetron Sputtering (HiPIMS) in SRF cavities. The cylindrical magnetrons are mounted on opposing arms, indicated by the arrows, which allows them to slowly move in a synchronized manner driven by computer-controlled stepper motors.
References
Zhenghuai Yang, Aurora Cecilia Araujo Martínez, Sachin V. Muley, Xiaorong Wang, Qing Ji, and André Anders, Vanadium oxide coatings to self-regulate current sharing in high-temperature superconducting cables and magnets, Journal of Applied Physics 128, 055105 (2020); https://doi.org/10.1063/5.0013783